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PCB Connectors (Board-to-Board Headers & Receptacles)
Manufacturer / Brand: TE
Desc.: PCB Mount Receptacle, Vertical, Board-to-Board, 306 Position, 1.9mm [.075in] Centerline, Header & Push-Push Assembly, Gold, Printed Circuit Board
Alias (Internal Part Number): -
Quantity Available: Over 430500 Pieces
Our Email: sales@buy-te.com (Price quote by email)
Datasheet for 445270-1:
Detailed Description for 445270-1:
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PCB Connector Assembly Type : PCB Mount Receptacle
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PCB Mount Orientation : Vertical
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Connector System : Board-to-Board
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Number of Positions : 306
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Centerline (Pitch) : 1.9 mm [ .075 in ]
445270-1 Parameters
- Manufacturer Part Number : 445270-1
- Manufacturer : TE
- Description : PCB Mount Receptacle, Vertical, Board-to-Board, 306 Position, 1.9mm [.075in] Centerline, Header & Push-Push Assembly, Gold, Printed Circuit Board
- Series: AMP-HDI
- TE Internal Part Code: 445270-1
- Internal Description: HSG ASY,RECPT,HDI 6 ROW
- Our Price : Contact by email
- Function : -
- Status : Active
- ROHS Status : Rohs Compliant
- Package Type : -
- Standard Packing Type : Reel / Tray / Box
- Standard Packing Quantity : -
- Working Temperature : -
- Other Part Number : TE-445270-1
- Shipping methods : DHL FEDEX UPS TNT
- Delivery Time : Ship within 1 day.
- Manufacturer Production time : 6-8 weeks (Normally have stocks)
- Weight : -
- Other category: -
Request Quotation for 445270-1
Best Price for 445270-1
Contact us to check the best price and real time inventory quantity for 445270-1. If you need any more information about 445270-1, you can also send us by email. Our email is sales@buy-te.com
445270-1 Technical Documents (Datasheet and Drawing Files)
Product Drawings
- HSG ASY,RECPT,HDI 6 ROW HSG ASY,RECPT,HDI 6 ROW English
CAD Files
- 3D PDF 3D_CVM_CVM_445270-1_AA.pdf 3D
- Customer View Model ENG_CVM_CVM_445270-1_AA.2d_dxf.zip English
- ENG_CVM_CVM_445270-1_AA.3d_igs.zip English
- ENG_CVM_CVM_445270-1_AA.3d_stp.zip English
Datasheets & Catalog Pages
- Products for Aerospace and Defense ENG_DS_1308940_Aerospace_Defense_0118.pdf English
Instruction Sheets
- Instruction Sheet (U.S.) ENG_SS_408-9552_O.pdf English
- ASSEMBLY AND HARDWARE INSTALLATION PROCEDURES FOR AMP-HDI SERIES 6-RO S_408-9552_O.tif English
Additional Description for 445270-1
Please review product documents or contact us for the latest agency approval information.
Please Note: Use the Product Drawing for all design activity.
Product Type Features
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PCB Connector Assembly Type : PCB Mount Receptacle
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Connector System : Board-to-Board
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Header Type : Header & Push-Push Assembly
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Sealable : No
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Connector & Contact Terminates To : Printed Circuit Board
Configuration Features
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Stackable : No
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Number of Rows : 6
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PCB Mount Orientation : Vertical
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Number of Positions : 306
Body Features
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Connector Profile : Standard
Contact Features
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Contact Base Material : Beryllium Copper
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PCB Contact Termination Area Plating Material : Tin-Lead
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Contact Shape & Form : Four Beam
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PCB Contact Termination Area Plating Material Thickness : 2.54 µm [ 100 µin ]
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Mating Square Post Dimension : .4 mm [ .016 in ]
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Contact Mating Area Plating Material : Gold
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Contact Mating Area Plating Material Thickness : .76 µm [ 30 µin ]
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Contact Type : Socket
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Contact Protection Type : Closed Entry Housing
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Contact Layout : Staggered
Termination Features
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Termination Post & Tail Length : 9.77 mm [ .385 in ]
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Termination Method to Printed Circuit Board : Through Hole - Solder
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Square Termination Post & Tail Dimension : .18 mm [ .007 in ]
Mechanical Attachment
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PCB Mount Retention Type : Mounting Hole
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Mating Alignment : With
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Mating Alignment Type : Center Guide
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PCB Mount Retention : With
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PCB Mount Alignment : With
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Connector Mounting Type : Fixing Screw
Housing Features
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Mating Entry Location : Side
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Centerline (Pitch) : 1.9 mm [ .075 in ]
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Housing Color : Natural
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Housing Material : Polyphenylene Sulfide (PPS)
Dimensions
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Connector Height : 9.22 mm [ .36 in ]
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Row-to-Row Spacing : 1.905 mm [ .075 in ]
Usage Conditions
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Operating Temperature Range : -65 – 125 °C [ -85 – 257 °F ]
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Housing Temperature Rating : Standard
Operation/Application
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Solder Process Feature : Board Standoff
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Circuit Application : Signal
Packaging Features
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Packaging Quantity : 1
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Packaging Method : Package
Other
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Comment : LRM (Line Replacement Module) Connector.
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